Seaford, DE – Skyray XRF has released the newest addition to its low-cost x-ray fluorescence instrument line; the Thick-800 XRF Analyzer. This model was developed specifically for measuring plating thickness and provides the solution for measuring single-layer, multi-layer, thin-film coatings and solders with composition.
The instrument is the first in the Skyray XRF product line to feature a top-down measurement system. Having the x-ray source and other components above the stage, the instrument can include a moveable sample stage; with the press of a button the sample can move three-dimensionally from point to point on a sample or up and down if needed. The top-down measurement system also allowed Skyray XRF to offer a three-sided chamber door so that users can measure smaller samples with the door closed (chamber size of 20â€x14â€x5â€) or open the door to create a ‘slotted chamber’ and fit larger samples or printed circuit boards.
The Thick-800 utilizes an electro-cooled Silicon-PIN semiconductor detection system, which offers a resolution of 149-160eV and does not require Liquid Nitrogen (LN2). It is also available with a Proportional Counter detection system to offer an even lower cost measurement analyzer. Many organizations that utilize XRF for coating thickness measurements look to reconditioned instruments to limit costs, but the low-cost Thick-800 allows a company with any sized budget to utilize the newest, most reliable technology.
“Our focus to this point has been offering low-cost, high-performing units for precious metal analysis and hazardous substance detection,†stated Scott Kramer, Director of Sales and Marketing for Skyray XRF. “The Thick-800, in addition to the EDX-600, allows us to offer low cost testing solutions for another common application.â€
Skyray XRF is the North American representative of an international leader in x-ray fluorescence technology. Overviews of the full product line, applications and XRF technology can be found at www.skyrayxrf.com.
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